Fast-curing adhesive sheet PS-D6
It is a fast-curing adhesive sheet that can be temporarily bonded at room temperature to around 80°C and can also cure in a short time. It also has resistance to solder reflow.
Features ■ Adhesive cures in a short time (150℃ x 5min) ■ Resistance to solder reflow (260℃) ■ Allows for room temperature bonding due to initial tackiness
- 企業：TOMOEGAWA CORPORATION
- 価格：Other
